Wednesday, January 11, 2012

TI Says First OMAP 5 Device Could Debut In Q4

According to Greg Delagi, the senior vice president and general manager of TI’s Wireless Business Unit, in an interview at the Consumer Electronics Show (CES), OMAP 5 will come to the consumer market “maybe in the fourth-quarter [of 2012].”  OMAP 5 uses 28 nanometer CMOS low-power process, differs from OMAP 4 in that it uses a dual-core A15 CPU, the next generation from chip designer ARM. That will improve power efficiency and graphics, among other features.

A number of those devices will be based on the Ice Cream Sandwich (4.0) version of Google‘s Android mobile platform for which TI served as the reference platform. Some of the most eye-catching elements in Ice Cream Sandwich like the “face unlock” facial recognition feature and the photo-stitching panoramic image function use processing elements built deep into OMAP, said Delagi.

OMAP5430 Chip Block Diagram - Thumbnail

OMAP 5 features
  • Designed to drive Smartphones, Tablets and other multimedia-rich mobile devices
  • Multi-core ARM® Cortex™ processors
  • Two ARM Cortex-A15 MPCore processors capable of speeds up to 2 GHz each
  • Two ARM Cortex-M4 processors for low-power offload and real-time responsiveness
  • Multi-core POWERVR™ SGX544-MPx graphics accelerators drive 3D gaming and 3D user interfaces
  • Dedicated TI 2D BitBlt graphics accelerator
  • IVA-HD hardware accelerators enable full HD 1080p60, multi-standard video encode/decode as well as 1080p30 stereoscopic 3D (S3D)
  • Faster, higher-quality image and video capture with up to 24 megapixels (or 12 megapixels S3D) imaging and 1080p60 (or 1080p30S3D) video
  • Supports four cameras and four displays simultaneously 
  • Packaging and memory: 14mm x 14mm, 0.4mm pitch PoP dual-channel LPDDR2 memory

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